SiliconOne Mechanical Packaging Engineer

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  • Location:
    San Jose, California, US
  • Area of Interest
    Engineer - Hardware
  • Compensation Range
    165700 USD - 232900 USD
  • Job Type
    Professional
  • Technology Interest
    Networking
  • Job Id
    1431753
Who We Are 
Cisco Silicon One is a business organization building and selling ASICs inside and outside of Cisco. We have a long track record of building large, high-performance Silicon ASICs for Cisco’s internal platforms and external customers. We are a specialized ASIC team with experts in all aspects of Silicon Design and system integration. Our substrates are using the latest fanout technologies for large scale integration. We are focused on all the latest technologies including optical and advanced packaging. 
 
What You’ll Do 
Cisco SiliconOne ASIC team is looking for an expert in advanced silicon substrate mechanical analysis to help us develop our next generation silicon and platforms. You will have advanced experience with co-simulation of silicon ASIC, interposer technologies, package substrate and PCB. You will be involved in substrate material development and SMT attach strategies and involved in multiple aspects of substrate planning and layout to make new silicon products successful. You will develop advanced packages utilizing new fanout technologies using new materials. You will lead thermal-mechanical analysis for preferred package and board attach and explore optimizations. You will extend a track record of leading similar products to first pass success by minimizing package design iterations. 
 
Responsibilities: 
• Setup models, integrating materials from PCB, BGA, substrate, bump, interposer, ASIC and all thermal attach solutions for large pin count devices. 
• Firm grasp of material science and the impact on substrate and final assembly. 
• Work with complex assemblies with HBM and chiplets. 
• Understand and simulate the impact at different temperatures, especially SMT attach. 
• Work with thermal modeling team to review models and simulations and impact on mechanical behavior. 
• Understand the complexities of qualification and challenges of bump and BGA placement. 
• Collaborate with package, system, and product operations teams to build a product. 
• Focus will be primarily on flip chip packages and heterogeneous integration of chip package design. 
• Understand and drive towards milestones to make development successful. 
• Contribute to team design reviews with actionable feedback to improve quality, capability, and experience of teammates. 
 
Who You Are 
You are a mechanical engineer with substrate expertise working on cutting-edge technologies and developing substrates that push the boundaries on power, integration, and fabrication/assembly technology. The scope of package development is industry leading. You will be working on and driving the design of the world’s most complex networks powered by silicon that carries over 90% of IP traffic. You will be an avid learner, eager to learn and process new technologies and rules, and excel in documenting and communicating critical information to the team. 
 
Minimum Qualifications: 
• Bachelor’s in Mechanical Engineering or related field, or equivalent experience. 
• 8 or more years of experience in the industry with IC Package or PCB development. 
• Experience with several high pin count, high-power and high-speed packages or equivalent PCBs and leading them to production. 
• Experience with fabrication and assembly design rules both for package as well as board. 
• Experience with assembly and package layout standards. 
• Experience in designing fully integrated mechanical solutions. 
• Knowledge of packaging materials and material properties. 

 
Preferred Qualifications: 
• Master's degree in Mechanical Engineering
• Knowledge of Icepak and Flotherm, Knowledge of mechanical simulation tools, Ansys Mechanical.
• Experience with mechanical and thermal analysis and familiarity with lab equipment used for material characterization and failure analysis.
• Familiarity and Interest in Advanced package layout with multiple die and non-symmetric layout. 
• Experience with Thermal modeling and simulation a plus. 



Message to applicants applying to work in the U.S. and/or Canada:

When available, the salary range posted for this position reflects the projected hiring range for new hire, full-time salaries in U.S. and/or Canada locations, not including equity or benefits. For non-sales roles the hiring ranges reflect base salary only; employees are also eligible to receive annual bonuses. Hiring ranges for sales positions include base and incentive compensation target. Individual pay is determined by the candidate's hiring location and additional factors, including but not limited to skillset, experience, and relevant education, certifications, or training. Applicants may not be eligible for the full salary range based on their U.S. or Canada hiring location. The recruiter can share more details about compensation for the role in your location during the hiring process.

U.S. employees have access to quality medical, dental and vision insurance, a 401(k) plan with a Cisco matching contribution, short and long-term disability coverage, basic life insurance and numerous wellbeing offerings. Employees receive up to twelve paid holidays per calendar year, which includes one floating holiday, plus a day off for their birthday. Employees accrue up to 20 days of Paid Time Off (PTO) each year and have access to paid time away to deal with critical or emergency issues without tapping into their PTO. We offer additional paid time to volunteer and give back to the community. Employees are also able to purchase company stock through our Employee Stock Purchase Program.

Employees on sales plans earn performance-based incentive pay on top of their base salary, which is split between quota and non-quota components. For quota-based incentive pay, Cisco typically pays as follows:

.75% of incentive target for each 1% of revenue attainment up to 50% of quota;

1.5% of incentive target for each 1% of attainment between 50% and 75%;

1% of incentive target for each 1% of attainment between 75% and 100%; and once performance exceeds 100% attainment, incentive rates are at or above 1% for each 1% of attainment with no cap on incentive compensation.

For non-quota-based sales performance elements such as strategic sales objectives, Cisco may pay up to 125% of target. Cisco sales plans do not have a minimum threshold of performance for sales incentive compensation to be paid.

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