Senior Photonics/Semiconductor Packaging Engineer

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  • Location:
    Holmdel, New Jersey, US
  • Alternate Location
    Maynard, Massachusetts, US
  • Area of Interest
    Engineer - Hardware
  • Compensation Range
    184000 USD - 266000 USD
  • Job Type
    Professional
  • Technology Interest
    AI or Artificial Intelligence
  • Job Id
    1433127

The application window is expected to close on: 12/24/25.

Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.

Acacia designs intelligent transceivers using advanced signal processing and photonic integration for the 100G, 400G and 1T bit speed fiber optic transmission market deployed in data center, metro, long-haul and ultra-long haul telecommunication networks.

Meet The Team:

You will be part of a multi-disciplinary team, including optical, mechanical, electrical, and manufacturing engineers. You will collaborate closely with Acacia’s Silicon Photonics development team on new product designs and with the Product Engineering and Quality teams to ensure smooth transition of our products to Manufacturing.

Your Impact:

You will play a key role in the design, development, and transfer to production of leading-edge transceivers utilizing silicon photonics and advanced DSP technology. In addition, you will:

  • Implement new package designs and processes
  • Work with OSATs to bring new products to volume production
  • Solve technical problems encountered in product prototyping, qualification, and production
  • Drive product solutions toward high-performance, high-reliability and low-cost

Minimum Qualifications:

  • BS degree with +12 years of experience, or Master's with +8 years of experience, or PhD +5 years of experience in photonics/semiconductor packaging.
  • Experience with semiconductor assembly processes such as die bonding, wire-bonding and 2.5D/3D assembly.
  • Experience with back-end wafer processing.
  • Experience with materials characterization and failure analysis, IC packaging materials and back-end wafer-level processes.
  • Experience with SiPh/PIC packaging, including mechanical, thermal, optics, and RF aspects.

Preferred Qualifications:

  • Experience working with OSATs and CMs on volume manufacturing.
  • Experience with laser packaging.
  • Experience with FEA software for thermal or mechanical analysis.

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Our passion is connection—we celebrate our employees’ diverse set of backgrounds and focus on unlocking potential. Cisconians often experience one company, many careers where learning and development are encouraged and supported at every stage. Our technology, tools, and culture pioneered hybrid work trends, allowing all to not only give their best, but be their best.

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Message to applicants applying to work in the U.S. and/or Canada:

When available, the salary range posted for this position reflects the projected hiring range for new hire, full-time salaries in U.S. and/or Canada locations, not including equity or benefits. For non-sales roles the hiring ranges reflect base salary only; employees are also eligible to receive annual bonuses. Hiring ranges for sales positions include base and incentive compensation target. Individual pay is determined by the candidate's hiring location and additional factors, including but not limited to skillset, experience, and relevant education, certifications, or training. Applicants may not be eligible for the full salary range based on their U.S. or Canada hiring location. The recruiter can share more details about compensation for the role in your location during the hiring process.

U.S. employees have access to quality medical, dental and vision insurance, a 401(k) plan with a Cisco matching contribution, short and long-term disability coverage, basic life insurance and numerous wellbeing offerings.

Employees receive up to twelve paid holidays per calendar year, which includes one floating holiday (for non-exempt employees), plus a day off for their birthday. Non-Exempt new hires accrue up to 16 days of vacation time off each year, at a rate of 4.92 hours per pay period. Exempt new hires participate in Cisco’s flexible Vacation Time Off policy, which does not place a defined limit on how much vacation time eligible employees may use, but is subject to availability and some business limitations. All new hires are eligible for Sick Time Off subject to Cisco’s Sick Time Off Policy and will have eighty (80) hours of sick time off provided on their hire date and on January 1st of each year thereafter.  Up to 80 hours of unused sick time will be carried forward from one calendar year to the next such that the maximum number of sick time hours an employee may have available is 160 hours. Employees in Illinois have a unique time off program designed specifically with local requirements in mind. All employees also have access to paid time away to deal with critical or emergency issues. We offer additional paid time to volunteer and give back to the community.

Employees on sales plans earn performance-based incentive pay on top of their base salary, which is split between quota and non-quota components. For quota-based incentive pay, Cisco typically pays as follows:

.75% of incentive target for each 1% of revenue attainment up to 50% of quota;

1.5% of incentive target for each 1% of attainment between 50% and 75%;

1% of incentive target for each 1% of attainment between 75% and 100%; and once performance exceeds 100% attainment, incentive rates are at or above 1% for each 1% of attainment with no cap on incentive compensation.

For non-quota-based sales performance elements such as strategic sales objectives, Cisco may pay up to 125% of target. Cisco sales plans do not have a minimum threshold of performance for sales incentive compensation to be paid.

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