The manufacturing engineer will be responsible for supporting the active alignment component attach process at wafer-scale using automated assembly equipment. You will take a hands-on and data driven approach to development, debugging, and continuous improvement that are mechanical and opto-electro-mechanical focused.
Job duties and responsibilities:
Help develop and improve repair/maintenance techniques for robotic grippers for automated equipment.
Provide training and technical support to sustaining team to ensure optimal up-time and performance of our assembly machines.
Develop and refine assembly methodologies for process repeatability and robustness.
Create process and engineering documents.
Implement lean manufacturing practices.
Develop standardized work instructions, implement 5S, balance lines, create process flow.
Review manufacturing activities and make recommendations to reduce cost, improve setup/cycle times, remove non-value added activities from the manufacturing process.
Implement SPC methodologies, setup control charts and KPI metrics to monitor process health.
Address process excursions/issues with a systematic approach to problem solving and statistical analysis.
Conduct DOE studies for process optimization and root cause analysis efforts.
Prepare various test/8D/MRB reports and present to the technical team/management for recommended actions.
Who you’ll work with:
You will be part of the manufacturing engineering team in our Carlsbad facility that supports high volume manufacturing operation of wafer-scale optical chipset assemblies as well as a module level pilot line in our cleanroom. We are a fast pace, dynamic, and hands-on group of engineers responsible for die attach, wirebond, active optical alignment, encap, singulation, and other assembly operations. We work closely with other cross-functional teams such as R&D, Quality, and Production to tackle some of the most difficult manufacturing challenges.
Who you are:
BS or MS in Mechanical, Industrial, or Electrical/Electronics Engineering
5+ years in micro-electronic device assembly and/or opto-electronics manufacturing environment with automated equipment experience is required. Die attach equipment experience is a plus.
Strong problem-solving skills using 8D method and sound engineering approach to decision making.
Experience leading PFMEA efforts and constructing control plans.
Good understanding of GR&R, CpK, correlation, and process control related statistical analysis.
Must be a self-starter to manage projects/tasks from beginning to completion with minimal supervision.
The ability to communicate effectively (verbal and written) across departments.
Working knowledge of statistical software tools such as JMP or equivalent. Strong MS Excel / Macro skills is a plus.
Proficient in Solidworks.
Must be comfortable working in a fast-paced environment.
Cisco Equal Opportunity
Cisco is an Affirmative Action and Equal Opportunity Employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, gender, sexual orientation, national origin, genetic information, age, disability, veteran status, or any other legally protected basis.
Cisco will consider for employment, on a case by case basis, qualified applicants with arrest and conviction records.
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